This complexity can result in neck-down areas of copper on the PCB and high current densities which can then lead to excessive copper heating and, in severe cases, copper failure. It's easy to use and the performance is very good.”Īnother effect of today’s more advanced, high-performance designs is the necessity for multiple and complex power distribution networks due to the increasing number of supply voltages. “This feature is one of the must-have features for serial channel design. “We’ve used the new HyperLynx LineSim interface 3D EM solver to analyze our vias for very high-speed interconnects,” said Yanfeng Yu, principal engineer, ZTE Corporation. The result is fast and accurate full interconnect analysis. Using a new feature in the HyperLynx 8.2 product, analysis is performed with 3D full-wave models for structures such as vias, and with 2D/2.5D solutions for constructs such as traces.
However, analyzing the complete interconnect using full-wave 3D field analysis would not be practical, as the computing times would be excessive. These major enhancements enable HyperLynx users to reliably utilize the industry’s most advanced high-speed IC and PCB technologies while developing more competitive products and hitting tight market windows.įor digital serial interconnects operating in data rate ranges of 5 to 28Gbps, it is important to include the 3D effects of certain PCB structures, such as vias, in the signal integrity analysis. Analysis of today’s multi-GHz SERDES channel interconnects-such as PCIe-Gen 3-requires specialized 3D modeling for accurate signal integrity analysis.Īnother major feature is the integration of the HyperLynx Thermal analysis with the HyperLynx PI (power integrity) products to calculate the affects of heat generated by areas of high current density in complex power distribution networks (PDNs) on the PCB.
Mentor Graphics Corporation (NASDAQ: MENT) has released HyperLynx® version 8.2, a suite of analysis tools offering significant new functionality for optimizing printed circuit board (PCB) designs, including 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Mentor Graphics: HyperLynx 8.2 is shipping!
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